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supplement publication# 23783 rev: a amendment/ +4 issue date: april 29, 2003 am29bl162c known good die 16 megabit (1 m x 16-bit) cmos 3.0 volt-only, burst-mode, boot sector flash memory?die revision 1 distinctive characteristics 32 words sequential with wrap around (linear 32), bottom boot one 8 kword, two 4 kword, one 112 kword, and seven 128 kword sectors single power supply operation ? regulated voltage range: 3.0 to 3.6 volt read and write operations and for compatibility with high performance 3.3 volt microprocessors read access times 22 ns burst access (at extended temperature range) 80 ns initial/random access alterable burst length via baa# pin power dissipation (typical) ? burst mode read: 15 ma @ 25 mhz, 20 ma @ 33 mhz ? program/erase: 20 ma ? standby mode, cmos: 22 a 5 v-tolerant data, address, and control signals sector protection ? implemented using in-system or via programming equipment ? temporary sector unprotect feature allows code changes in previously locked sectors unlock bypass program command ? reduces overall programming time when issuing multiple program command sequences embedded algorithms ? embedded erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors ? embedded program algorithm automatically writes and verifies data at specified addresses minimum 100,000 erase cycle guarantee per sector 20-year data retention at 125 c compatibility with jedec standards ? pinout and software compatible with single- power supply flash ? superior inadvertent write protection ? backward-compatible with amd am29lv and am29f flash memories: powers up in asynchronous mode for system boot, but can immediately be placed into burst mode data# polling and toggle bits ? provides a software method of detecting program or erase operation completion ready/busy# pin (ry/by#) ? provides a hardware method of detecting program or erase cycle completion erase suspend/erase resume ? suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation hardware reset pin (reset#) ? hardware method to reset the device for reading array data tested to datasheet specifications at temperature quality and reliability levels equivalent to standard packaged components
2 am29bl162c known good die supplement general description the am29bl162c in known good die (kgd) form is a 16 mbit, 3.0 volt-only flash memory. amd defines kgd as standard product in die form, tested for functionality and speed. amd kgd products have the same reliability and quality as amd products in packaged form. am29bl162c features the am29bl162c is organized as 1,048,576 words. it is designed to be programmed in-system with the stan- dard system 3.0-volt v cc supply. a 12.0-volt v pp or 5.0 v cc is not required for program or erase operations. the device can also be programmed in standard eprom programmers. the device offers access times of 80 ns, allowing high speed microprocessors to operate without wait states. to eliminate bus contention the device has separate chip enable (ce#), write enable (we#) and output enable (oe#) controls. burst mode features the am29bl162c offers a linear burst mode?a 32 word sequential burst with wrap around?in a bottom boot configuration only. this devices require additional control pins for burst operations : load burst address (lba#), burst address advance (baa#), and clock (clk). this implementation allows easy interface with minimal glue logic to a wide range of microprocessors/microcontrollers for high perfor- mance read operations. amd flash memory features each device requires only a single 3.0 volt power supply for both read and write functions. internally generated and regulated voltages are provided for the program and erase operations. the i/o and control signals are 5v tolerant. the am29bl162c is entirely command set compatible with the jedec single-power-supply flash stan- dard . commands are written to the command register using standard microprocessor write timings. register contents serve as input to an internal state-machine that controls the erase and programming circuitry. write cycles also internally latch addresses and data needed for the programming and erase operations. reading data out of the device is similar to reading from other flash or eprom devices. device erasure occurs by executing the erase com- mand sequence. this initiates the embedded erase algorithm?an internal algorithm that automatically pre- programs the array (if it is not already programmed) be- fore executing the erase operation. during erase, the device automatically times the erase pulse widths and verifies proper cell margin. the host system can detect whether a program or erase operation is complete by observing the ry/by# pin, or by reading the dq7 (data# polling) and dq6 (toggle) status bits . after a program or erase cycle has been completed, the device is ready to read array data or accept another command. the sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. the device is fully erased when shipped from the factory. hardware data protection measures include a low v cc detector that automatically inhibits write operations dur- ing power transitions. the hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. this can be achieved in-system or via programming equipment. the erase suspend/erase resume feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. true background erase can thus be achieved. the hardware reset# pin terminates any operation in progress and resets the internal state machine to reading array data. the reset# pin may be tied to the system reset circuitry. a system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the flash memory. the device offers two power-saving features. when addresses have been stable for a specified amount of time, the device enters the automatic sleep mode . the system can also place the device into the standby mode . power consumption is greatly reduced in both these modes. amd?s flash technology combines years of flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness. the device electrically erases all bits within a sector simultaneously via fowler-nordheim tunneling. the data is programmed using hot electron injection. electrical specifications refer to the am29bl162c data sheet, publication number 22142, for full electrical specifications on the am29bl162c in kgd form.
supplement am29bl162c known good die 3 product selector guide family part number am29bl162c speed option regulated voltage range: v cc =3.0?3.6 v 80r max random/initial access time, ns (t acc , t iacc )80 max ce# access time, ns (t ce ) 80 max oe# and burst access time, ns (t oe , t bacc ) 22 (at 30 pf loading)
4 am29bl162c known good die supplement ac characteristics burst mode read note: initial valid data will be output after second clock rising edge of lba# assertion. parameter description speed options and temperature ranges unit jedec std. 80r t iacc initial access time lba# valid clock to output delay (see note) max 80 ns t bacc burst access time baa# valid clock to output delay max 24 ns t lbas lba# setup time min 6 ns t lbah lba# hold time min 2 ns t baas baa# setup time min 6 ns t baah baa# hold time min 2 ns t bdh data hold time from next clock cycle max 4 ns t acs address setup time to clk (see note) min 6 ns t ach address hold time from clk (see note) min 2 ns t oe output enable to output valid max 24 ns t oez output enable to output high z max 25 ns t cez chip enable to output high z min 25 ns t ces ce# setup time to clock min 6 ns
supplement am29bl162c known good die 5 ac characteristics erase/program operations notes: 1. not 100% tested. parameter description speed options jedec std 80r unit t avav t wc write cycle time (note 1) min 80 ns t avwl t as address setup time min ns t wlax t ah address hold time min 45 ns t dvwh t ds data setup time min 35 ns t whdx t dh data hold time min 0 ns t oes output enable setup time min 0 ns t ghwl t ghwl read recovery time before write (oe# high to we# low) min 0 ns t elwl t cs ce# setup time min 0 ns t wheh t ch ce# hold time min 0 ns t wlwh t wp write pulse width min 35 ns t whwl t wph write pulse width high min 30 ns t whwh1 t whwh1 programming operation (note 2) typ 9 s t whwh2 t whwh2 sector erase operation (note 2) typ 3 sec t vcs v cc setup time (note 1) min 50 s t rb recovery time from ry/by# min 0 ns t busy program/erase valid to ry/by# delay min 90 ns
6 am29bl162c known good die supplement ac characteristics alternate ce# controlled erase/program operations notes: 1. not 100% tested. parameter description speed options jedec std 80r unit t avav t wc write cycle time (note 1) min 80 ns t avel t as address setup time min ns t elax t ah address hold time min 45 ns t dveh t ds data setup time min 35 ns t ehdx t dh data hold time min 0 ns t oes output enable setup time min 0 ns t ghel t ghel read recovery time before write (oe# high to we# low) min 0 ns t wlel t ws we# setup time min 0 ns t ehwh t wh we# hold time min 0 ns t eleh t cp ce# pulse width min 35 ns t ehel t cph ce# pulse width high min 30 ns t whwsh1 t whwh1 programming operation (note 2) typ 9 s t whwh2 t whwh2 sector erase operation (note 2) typ 3 sec
supplement am29bl162c known good die 7 die photograph die pad locations 11 10 51 1 2 3 4 5 6 7 8 94847 50 49 39 40 41 42 43 44 45 46 23 27 28 25 24 26 37 36 35 34 33 32 31 30 29 12 15 16 13 14 22 21 20 19 18 17 38 52 amd logo location y x
8 am29bl162c known good die supplement pad descriptions (relative to pad 1) pad signal pad center (mils) pad center (millimeters) xyxy 1v cc 0.00 0.00 0.00 0.00 2v cc ?8.15 0.00 ?0.21 0.00 3 dq4 ?15.02 0.00 ?0.38 0.00 4 dq12 ?24.66 0.00 ?0.63 0.00 5 dq5 ?33.23 0.00 ?0.84 0.00 6 dq13 ?42.87 0.00 ?1.09 0.00 7 dq6 ?51.43 0.00 ?1.31 0.00 8 dq14 ?61.08 0.00 ?1.55 0.00 9 dq7 ?69.64 0.00 ?1.77 0.00 10 dq15 ?79.28 0.00 ?2.01 0.00 11 v ss ?86.15 0.00 ?2.19 0.00 12 n/c ?86.15 ?282.09 ?2.19 ?7.16 13 a16 ?77.53 ?282.09 ?1.97 ?7.16 14 a15 ?68.90 ?282.09 ?1.75 ?7.16 15 a14 ?60.28 ?282.09 ?1.53 ?7.16 16 a13 ?51.65 ?282.09 ?1.31 ?7.16 17 a12 ?41.60 ?282.09 ?1.06 ?7.16 18 a11 ?31.55 ?282.09 ?0.80 ?7.16 19 a10 ?21.50 ?282.09 ?0.55 ?7.16 20 a9 ?11.45 ?282.09 ?0.29 ?7.16 21 a8 ?1.16 ?282.09 ?0.03 ?7.16 22 a19 8.89 ?282.09 0.23 ?7.16 23 v cc 18.94 ?282.09 0.48 ?7.16 24 lba 27.10 ?282.09 0.69 ?7.16 25 we# 45.15 ?282.09 1.15 ?7.16 26 reset# 55.45 ?282.09 1.41 ?7.16 27 ry/by# 65.38 ?282.09 1.66 ?7.16 28 a18 75.43 ?282.09 1.92 ?7.16 29 a17 85.48 ?282.09 2.17 ?7.16 30 a7 95.53 ?282.09 2.43 ?7.16 31 a6 105.58 ?282.09 2.68 ?7.16 32 a5 115.63 ?282.09 2.94 ?7.16 33 a4 125.68 ?282.09 3.19 ?7.16 34 a3 135.73 ?282.09 3.45 ?7.16 35 a2 144.36 ?282.09 3.67 ?7.16 36 a1 152.98 ?282.09 3.89 ?7.16 37 a0 161.60 ?282.09 4.10 ?7.16 38 ce# 170.23 ?282.09 4.32 ?7.16 39 v ss 170.23 0.00 4.32 0.00 40 oe# 156.98 0.00 3.99 0.00 41 dq0 148.40 0.00 3.77 0.00 42 dq8 138.76 0.00 3.52 0.00 43 dq1 130.19 0.00 3.31 0.00 44 dq9 120.55 0.00 3.06 0.00 45 dq2 111.98 0.00 2.84 0.00 46 dq10 102.34 0.00 2.60 0.00 47 dq3 93.78 0.00 2.38 0.00
supplement am29bl162c known good die 9 note: the coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment. 48 dq11 84.13 0.00 2.14 0.00 49 v ss 76.52 0.00 1.94 0.00 50 clk 66.47 0.00 1.69 0.00 51 baa 56.42 0.00 1.43 0.00 52 ind# 16.28 0.00 0.41 0.00 pad signal pad center (mils) pad center (millimeters) xyxy
10 am29bl162c known good die supplement pad descriptions (relative to die center) pad signal pad center (mils) pad center (millimeters) xyxy 1v cc ?42.04 139.03 ?1.07 3.53 2v cc ?50.19 139.03 ?1.27 3.53 3 dq4 ?57.06 139.03 ?1.45 3.53 4 dq12 ?66.70 139.03 ?1.69 3.53 5 dq5 ?75.27 139.03 ?1.91 3.53 6 dq13 ?84.91 139.03 ?2.16 3.53 7 dq6 ?93.47 139.03 ?2.37 3.53 8 dq14 ?103.12 139.03 ?2.62 3.53 9 dq7 ?111.68 139.03 ?2.84 3.53 10 dq15 ?121.32 139.03 ?3.08 3.53 11 v ss ?128.19 139.03 ?3.26 3.53 12 nc ?128.19 ?143.06 ?3.26 ?3.63 13 a16 ?119.57 ?143.06 ?3.04 ?3.63 14 a15 ?110.94 ?143.06 ?2.82 ?3.63 15 a14 ?102.32 ?143.06 ?2.60 ?3.63 16 a13 ?93.69 ?143.06 ?2.38 ?3.63 17 a12 ?83.64 ?143.06 ?2.12 ?3.63 18 a11 ?73.59 ?143.06 ?1.87 ?3.63 19 a10 ?63.54 ?143.06 ?1.61 ?3.63 20 a9 ?53.49 ?143.06 ?1.36 ?3.63 21 a8 ?43.20 ?143.06 ?1.10 ?3.63 22 a19 ?33.15 ?143.06 ?0.84 ?3.63 23 v cc ?23.10 ?143.06 ?0.59 ?3.63 24 lba ?14.94 ?143.06 ?0.38 ?3.63 25 we# 3.11 ?143.06 0.08 ?3.63 26 reset# 13.41 ?143.06 0.34 ?3.63 27 ry/by# 23.34 ?143.06 0.59 ?3.63 28 a18 33.39 ?143.06 0.85 ?3.63 29 a17 43.44 ?143.06 1.10 ?3.63 30 a7 53.49 ?143.06 1.36 ?3.63 31 a6 63.54 ?143.06 1.61 ?3.63 32 a5 73.59 ?143.06 1.87 ?3.63 33 a4 83.64 ?143.06 2.12 ?3.63 34 a3 93.69 ?143.06 2.38 ?3.63 35 a2 102.32 ?143.06 2.60 ?3.63 36 a1 110.94 ?143.06 2.82 ?3.63 37 a0 119.57 ?143.06 3.04 ?3.63 38 ce# 128.19 ?143.06 3.26 ?3.63 39 v ss 128.19 139.03 3.26 3.53 40 oe# 114.94 139.03 2.92 3.53 41 dq0 106.36 139.03 2.70 3.53 42 dq8 96.72 139.03 2.46 3.53 43 dq1 88.15 139.03 2.24 3.53 44 dq9 78.51 139.03 1.99 3.53 45 dq2 69.94 139.03 1.78 3.53 46 dq10 60.30 139.03 1.53 3.53 47 dq3 51.74 139.03 1.31 3.53
supplement am29bl162c known good die 11 note: the coordinates above are relative to the die center and can be used to operate wire bonding equipment. 48 dq11 42.10 139.03 1.07 3.53 49 v ss 34.48 139.03 0.88 3.53 50 clk 24.43 139.03 0.62 3.53 51 baa 14.38 139.03 0.37 3.53 52 ind# ?25.76 139.03 ?0.65 3.53 pad signal pad center (mils) pad center (millimeters) xyxy
12 am29bl162c known good die supplement ordering information standard products amd standard products are available in several packages and operating ranges. the order number (valid combination) is formed by a combination of the following: valid combinations valid combinations list configurations planned to be sup- ported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly released combinations. am29bl162c b 80r dp e 1 die revision this number refers to the specific amd manufacturing process and product technology reflected in this document. it is entered in the revision field of amd standard product nomenclature. temperature range i = industrial (?40 c to +85 c) e = extended (?55 c to +125 c) h = super extended (?55 c to +145 c) package type and minimum order quantity dp = waffle pack 80 die per 5 tray stack dg = gel-pak? die tray 252 die per 6 tray stack dt = surftape? (tape and reel) 1600 per 7-inch reel dw = gel-pak? wafer tray (sawn wafer on frame) call amd sales office for minimum order quantity speed option see product selector guide and valid combinations boot code sector architecture b = bottom sector device number/description am29bl162c known good die 16 megabit (1 m x 16-bit) cmos flash memory?die revision 1 3.0 volt-only program and erase valid combinations am29bl162cb-80r dpi 1, dpe 1, dph 1 dgi 1, dge 1, dgh 1 dti 1, dte 1, dth 1 dwi 1, dwe 1, dwh 1
supplement am29bl162c known good die 13 packaging information surftape packaging gel-pak and waffle pack packaging direction of feed orientation relative to leading edge of tape and reel 16 mm amd logo location orientation relative to top left corner of gel-pak and waffle pack cavity plate amd logo location
14 am29bl162c known good die supplement product test flow figure 1 provides an overview of amd?s known good die test flow. for more detailed information, refer to the am29bl162c product qualification database. amd implements quality assurance procedures throughout the product test flow. these qa procedures also allow amd to produce kgd products without requiring or implementing burn-in. in addition, an off-line qualifica- tion maintenance program (qmp) guarantees amd standards are met on kgd products. figure 1. amd kgd product test flow wafer sort 1 bake 24 hours at 250 c wafer sort 2 wafer sort 3 high temperature packaging for shipment shipment dc parameters functionality programmability erasability data retention dc parameters functionality programmability erasability dc parameters functionality programmability erasability speed incoming inspection wafer saw die separation 100% visual inspection die pack
supplement am29bl162c known good die 15 physical specifications die dimensions . . . . . . . . . . 269.7 mils x 303.94 mils . . . . . . . . . . . . . . . . . . . . . . . . . . 6.85 mm x 7.72 mm die thickness . . . . . . . . . . . . . . . . . . . . . . . . .500 m bond pad size . . . . . . . . . . . . . . . 4.69 mils x 4.69mils . . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 m x 115.9 m pad area free of passivation . . . . . . . . . .13.99 mils 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 m 2 pads per die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 bond pad metalization . . . . . . . . . . . . . . . . . . . . al/cu die backside . . . . . . . . . . . . . . . . . . . . . . . . no metal, may be grounded (optional) passivation. . . . . . . . . . . . . . . . . . nitride/sog/nitride dc operating conditions v cc (supply voltage) . . . . . . . . . . . . . . . 3.0 v to 3.6 v operating temperature industrial . . . . . . . . . . . . . . . . . . . ?40 c to +85 c extended . . . . . . . . . . . . . . . . . . ?55 c to +125 c super extended. . . . . . . . . . . . . ?55 c to +145 c manufacturing information manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . fasl wafer sort test . . . . . . . . . . . sunnyvale, ca, usa & . . . . . . . . . . . . . . . . . . . . . . . . . . . . penang, malaysia manufacturing id (bottom boot) . . . . . . . . .98849abk preparation for shipment . . . . . . . . penang, malaysia fabrication process . . . . . . . . . . . . . . . . . . . cs39ls die revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 special handling instructions processing do not expose kgd products to ultraviolet light or process them at temperatures greater than 250 c. failure to adhere to these handling instructions will result in irreparable damage to the devices. for best yield, amd recommends assembly in a class 10k clean room with 30% to 60% relative humidity. storage store at a maximum temperature of 30 c in a nitrogen- purged cabinet or vacuum-sealed bag. observe all standard esd handling procedures. dc parameter exceptions the following specifications replace those given in the am29bl162 data sheet (publication number 22142): notes: 2. maximum i cc specifications are tested with v cc = v cc max. 3. automatic sleep mode enables the low power mode when addresses remain stable for t acc + 30 ns. parameter description test conditions typ max unit i cc3 v cc standby current (note 2) ce#, reset# = v cc 0.3 v 22 35 a i cc4 v cc standby current during reset (note 2) reset# = v ss 0.3 v 22 35 a i cc5 automatic sleep mode (notes 2, 3) v ih = v cc 0.3 v; v il = v ss 0.3 v oe# = v ih 30 50 a oe# = v il 30 50 a
16 am29bl162c known good die supplement ac characteristics read operations notes: 1. not 100% tested. 2. see figure 13 and table 10 for test specifications parameter description test setup speed options and temperature ranges unit jedec std. 80r t avav t rc read cycle time (note 1) min 80 ns t avqv t acc address to output delay ce# = v il oe# = v il max 80 ns t elqv t ce chip enable to output delay oe# = v il max 80 ns t glqv t oe output enable to output delay max 24 ns t ehqz t df chip enable to output high z (note 1) max 24 ns t ghqz t df output enable to output high z (note 1) max 25 ns t oeh output enable hold time (note 1) read min 0 ns toggle and data# polling min 10 ns t axqx t oh output hold time from addresses, ce# or oe#, whichever occurs first (note 1) min 0 ns
supplement am29bl162c known good die 17 terms and conditions of sale for amd non-volatile memory die all transactions relating to unpackaged die under this agreement shall be subject to amd?s standard terms and conditions of sale, or any revisions thereof, which revisions amd reserves the right to make at any time and from time to time. in the event of conflict between the provisions of amd?s standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling. amd warrants unpackaged die of its manufacture (?known good die? or ?die?) against defective mate- rials or workmanship for a period of one (1) year from date of shipment. this warranty does not extend beyond the first purchaser of said die. buyer assumes full responsibility to ensure compliance with the appropriate handling, assembly and processing of known good die (including but not limited to proper die preparation, die attach, wire bonding and related assembly and test activities), and compliance with all guidelines set forth in amd?s specifications for known good die, and amd assumes no responsibility for environmental effects on known good die or for any activity of buyer or a third party that damages the die due to improper use, abuse, negligence, improper installation, accident, loss, damage in transit, or unau- thorized repair or alteration by a person or entity other than amd (?warranty exclusions?). the liability of amd under this warranty is limited, at amd?s option, solely to repair the die, to send replace- ment die, or to make an appropriate credit adjustment or refund in an amount not to exceed the original pur- chase price actually paid for the die returned to amd, provided that: (a) amd is promptly notified by buyer in writing during the applicable warranty period of any defect or nonconformity in the known good die; (b) buyer obtains authorization from amd to return the defective die; (c) the defective die is returned to amd by buyer in accordance with amd?s shipping instruc- tions set forth below; and (d) buyer shows to amd?s satisfaction that such alleged defect or nonconformity actually exists and was not caused by any of the above-referenced warranty exclusions. buyer shall ship such defective die to amd via amd?s carrier, col- lect. risk of loss will transfer to amd when the defec- tive die is provided to amd?s carrier. if buyer fails to adhere to these warranty returns guidelines, buyer shall assume all risk of loss and shall pay for all freight to amd?s specified location. the aforementioned pro- visions do not extend the original warranty period of any known good die that has either been repaired or replaced by amd. without limiting the foregoing, except to the extent that amd expressly warrants to buyer in a separate agreement signed by amd, amd makes no warranty with respect to the die?s processing of date data, and shall have no liability for damages of any kind, under equity, law, or any other theory, due to the failure of such known good die to process any par- ticular data containing dates, including dates in and after the year 2000, whether or not amd received notice of the possi- bility of such damages. this warranty is expressed in lieu of all other warranties, expressed or implied, including the implied warranty of fitness for a particular purpose, the implied warranty of merchantability and of all other obligations or liabilities on amd?s part, and it neither assumes nor autho- rizes any other person to assume for amd any other liabilities. the foregoing constitutes the buyer?s sole and exclu- sive remedy for the furnishing of defec- tive or non conforming known good die and amd shall not in any event be liable for increased manufacturing costs, downtime costs, damages relating to buyer?s procurement of substitute die (i.e., ?cost of cover?), loss of profits, rev- enues or goodwill, loss of use of or damage to any associated equipment, or any other indirect, incidental, special or consequential damages by reason of the fact that such known good die shall have been determined to be defective or non conforming. buyer agrees that it will make no warranty representa- tions to its customers which exceed those given by amd to buyer unless and until buyer shall agree to indemnify amd in writing for any claims which exceed amd?s warranty. known good die are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of the die can reason- ably be expected to result in a personal injury. buyer?s use of known good die for use in life support applica- tions is at buyer?s own risk and buyer agrees to fully indemnify amd for any damages resulting in such use or sale.
18 am29bl162c known good die supplement revision summary revision a (june 7, 2000) initial release. revision a+1 (december 19, 2000) corrected reference to bl162c data sheet publication number. ordering information added quantities for waffle pack, gel-pak, and sur- ftape. revision a+2 (september 11, 2002) moved pad 11 on die pad locations diagram added pad 52 to pad description tables (relative to pad 1 and relative to die center) revision a+2 (september 11, 2002) changed title from boot sector flash to burst-mode, boot sector flash. product selector guide removed note #2. ac characteristics added read operations, burst mode read, and erase/ program operations and alternate ce# controlled erase/program operations tables. revision a + 3 (april 29, 2003) product test flow replaced text preceding figure 1. trademarks copyright ? 2003 advanced micro devices, inc. all rights reserved. amd, the amd logo, and combinations thereof are r egistered trademarks of advanced micro devices, inc. product names used in this publication ar e for identification purposes only and may be trademarks of their respective companies .

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